tF&f’s patented Pumped Liquid Multiphase Cooling (PLMC) platform provides high performance and design flexibility for use in chip-through-data-center applications. In its simplest form, it can be thought of as an externally pumped heat pipe.



This deceptively simple cooling approach, when implemented with tF&f’s patented cold plate technology and proprietary micro-pumps, yields very high performance and is very energy efficient. PLMC is capable of transferring 1 kW of heat over a distance of several hundred meters while using only a few watts of power.

The tF&f performance advantage is shown in the chart below – over twice that of today’s active air-cooling in a typical application. PLMC is the lowest cost approach per watt of heat removed.