“In order to enhance function, appropriate form must exist or be created.”
—Ida P. Rolf
Thermal Form and Function, Inc. has created substantial intellectual property relating to PLMC™ technology including issued and pending patents, manufacturing know-how, and trade secrets. We pioneered refrigerant-based thermal management techniques proven to cool 400W+ microprocessors, which cannot be achieved by any other means.
We currently hold 30 patents for innovations in thermal technology.
We have developed key enabling components for refrigerant-based cooling for electronics. These include a family of refrigerant pumps ranging from 2.5kW to 100kW thermal load capacity and proprietary, low-cost, meso-scale heat exchangers (MHX™) in a variety of forms suitable for very high-performance chip-level cooling. The pumps are expressly designed for refrigerant pumping near saturation conditions, and the MHX™ devices offer better performance than even microchannel heat sinks.
THERMAL FORM & FUNCTION, INC. • MANCHESTER, MA 01944 • 978-526-9672 • TFANDF.COM © 2012 • TERMS OF USE
