tF&f ’s technology platform has wide applicability across markets (IT, telecommunications, military, electro-optics, industrial) as well as scalability in particular market segments.

We currently have three system products in evaluation, qualification, and life testing and are actively engaged with OEM partners.

• PC Cooling System (PCCS) is targeted at desktop/deskside PCs, workstations, and media center computers, and is focused on providing high performance cooling with low energy expenditure and low acoustic noise.
  
  
• Box/Blade Cooling System (BCS) addresses high performance modular servers and provides a self-contained cooling system for maximum-performance microprocessors in single, dual, and quad processor configurations.
  
  
• Rack Cooling System (RCS) is a rack-mountable cooling unit that removes up to 10kW of heat from the cooling air stream in a rack, allowing greater processor density while relieving hot spots in the data center.

In addition to these first-generation products, tF&f also provides thermal design and engineering services for custom applications for cooling needs from 100W to 50 kW through our Engineered Solutions product line.