Thermal Form and Function

 




TF&F PLMC has the ability to achieve very low Power Utilization Efficiency (PUE) =<1.08. It does not require any chillers or any vapor compression.
 
Current thermal path
Current Data Center thermal path
PLMC thermal path
PLMC thermal path

One of the PLMC cooled facility embodiments is illustrated below for the PetaFlop computing container design proposal. It involves R-134a condensers on the roof, processor count, cooling required, thermal budget, refrigerant flow and pumps.
PetaFlop

 To get a more detailed description and analysis of the TF&F approach to facility cooling, please check: http://www.tfandf.com/documents/InterPACK-1176.pdf