The performance limits of conventional cooling techniques are being reached in commercial and military electronics, industrial and medical devices, and electro-optical systems. The thermal engineering challenge is to:

• Maintain critical device temperatures at appropriate levels.
• Handle increasingly high heat densities in modules, boxes, and racks.
• Economically cool data centers and central offices despite unprecedented (and in some cases unplanned-for) levels of waste heat generation.

The figures below show the historic and projected chip power and rack-level heat density trends for digitial electronics. It is clear that now is the time for advanced cooling technologies. At TF&F, we believe that Pumped Liquid Multiphase Cooling (PLMC) is the advanced cooling candidate of choice.