Thermal control of electronic equipment has been a major design issue from the era of vacuum tubes through today’s multi-GHz sub-micron integrated circuits. The cooling problem is currently at a critical stage - heat is a major issue and some technical authorities question the viability of continuing to progress according to Moore’s Law.

At Thermal Form & Function, we don’t believe that cooling should be a limitation that forces electronics designers to compromise on performance, density, or acoustic noise. We DO believe that an appropriate combination of technology and design can remove the current limits and provide headroom for years into the future.

Our solution is called Pumped Liquid Multiphase Cooling (PLMC) – an elegant, functional approach that uses advanced thermal engineering along with unique miniaturized system elements and available high-volume components to achieve small size, high efficiency, and very high performance at a cost that will allow Moore’s Law to progress unimpeded.