thermal Form & function is a development-stage company providing advanced cooling solutions for digital and power electronics – from notebooks and desktops through data centers.
Founded by industry veterans, tF&f has developed a truly scalable cooling platform that removes thermal management barriers from system design.
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tF&f’s innovative technology platform uses two-phase liquid cooling with non-toxic, non-conductive, and non-reactive low-cost refrigerant.
The result: extremely high performance and high efficiency cooling in a small footprint at the lowest available cost per watt of heat removed.
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Our first generation products are focused on computer and tele-communications applications.
Our current solutions and developments include:
PC Cooling System
Box/Blade System
Rack Cooling System
Micro Pump
We also provide custom solutions to thermal engineering problems under our Engineered Solutions product line.
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4/20/07
tF&f announces strategic partnership with Parker-Hannifin
Corporation.
1/17/05
tF&f invited to present at Interpack 2005 / ASME National Heat Transfer Conference.
12/15/04
tF&f achieves 350 W/cm2 chip-level cooling.
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