thermal Form & function is a development-stage company providing advanced cooling solutions for digital and power electronics – from notebooks and desktops through data centers.
Founded by industry veterans, tF&f has developed a truly scalable cooling platform that removes thermal management barriers from system design.
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tF&f’s innovative technology platform uses two-phase liquid cooling with non-toxic, non-conductive, and non-reactive low-cost refrigerant.
The result: extremely high performance and high efficiency cooling in a small footprint at the lowest available cost per watt of heat removed.
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Our first generation products are focused on computer and tele-communications applications.
Our current solutions include:
PC Cooling System
Box Cooling System
Rack Cooling System
We also provide custom solutions to thermal engineering problems under our Engineered Solutions product line.
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1/17/05
tF&f invited to present at Interpack 2005 / ASME National Heat Transfer Conference
12/15/04
tF&f achieves 350 W/cm2 chip-level cooling
8/15/04
tF&f partners in SBIR contract for radar cooling
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